A Novel Approach for Cooling Electronics Using a Combined Heat Pipe and Thermoelectric Module

Abstract

The development of effective cooling systems for microprocessors, specifically for CPU and other computer chips, is greatly important due to growth of high speed performance chips, which operate at elevated heat rates. The same issues apply for adjacent units including RAM and HDD also contributing to overall generation of heat inside computer. Problem statement: Conventional cooling system for desktop PC has many problems, especially cooling performance. Lifespan of devices and reliable operation are largely dependent on junction temperature. Total power dissipation of recently introduced, new generation microprocessors had been increasing rapidly, pushing desktop system cooling technology close to its limits. Approach: Present research focused on a system for removal of dissipated heat that combined the advantages of heat pipe and thermoelectric modules. Proposed research presented a numerical analysis of a novel cooling system for electronics. Configuration studied concerns microprocessors and other computer ships. Simulations performed in this research were based on use of computational fluid dynamics and results obtained in terms of cooling efficiencies were compared to those of the traditional cooling. Heat resistance and temperature of each component were investigated in this modeling. Results: Lowest core temperature was found below 75°C and total thermal resistance of cooling system is 0.095°C/W. Conclusion/Recommendations: Proposed cooling systems had sufficient capacity for cooling 200 W heat dissipation. Temperature of proposed cooling system is lower than both existing cooling systems. Temperature of all components, CPU, heat pipe, TEC and heat sink were below 75°C. Thermal resistance characteristic of a cooling system had a major effect on cooling performance.